Your position:Scribing& Adhesive film
Purpose: To prepare for sticking, separate the chips on the wafer into individual pieces. Use silver adhesive (or insulating adhesive) to stick the chip onto the frame for easy subsequent work Process flow. The existing bonding processes of Xintong include eutectic, adhesive (insulation glue, silver glue), solder, solder paste, flip chip, etc.
Plastic packaging& Aging heat
Purpose of plastic sealing: to seal the chip and inner leads of the product that has been pressure welded with adhesive sheets.
The purpose of aging is to fully react epoxy resin and better protect the product.
Adhesive curing
Purpose: Accurate temperature control of Oven oven is crucial for the curing of adhesive, ensuring the quality and performance of chips. Ensure temperature uniformity meets the manufacturer's recommended standards during the chip adhesive curing process.
Electroplating& Forming separation
Tin plating on the exposed forehead pins for easy board soldering.
Remove the edge ribs of the frame and bend the pins according to the design requirements for future testing and use.
Pressure welding/wire bonding
Purpose: Connect the electrodes on the chip to the frame. Using ultrasound, heat, and force to complete the connection between gold (or copper, silver alloy) wire and welding metal (electrode or frame coating).
Test printing
Electrical performance testing, qualified products are printed on the plastic packaging body using laser screen printing as required.
Production factory process flow
The entire process of sealing and testing production has world-class production equipment.
・Grinding and scratching equipment: DISCO、 Neon Tech、Heyan
Tech
・Adhesive equipment: ASM、 TOSOK、 HOSON、 ACCURACY
・Pressure welding equipment: ASM、
K&S、 OE
・Plastic sealing equipment: TOWA、 ASM、 KK、 Rishen
・Oxidation brightening equipment:
SINYANG、 SOTEC
・Molding and separation equipment: CORBEST、 MSL、
SM、PuBei
・Testing equipment: STATEC、 ChangChuan tech、 HongBang tech、
PowerTECH、AccoTEST
・Sorting, printing, and weaving equipment: UENO SEIKI、ASM、 S-king、
Haye tech、 GDH tech
・Laser printing and tape equipment:PowerTECH、 TSM、 KEC
Reliability Test Standards
Quality System Certification Certificate
